About the role
Job Description onsemi is seeking skilled Technicians to support semiconductor manufacturing operations in areas such as Die Bond/Clip Bonding, Wire Bonding The role involves operating and monitoring specialized equipment, performing machine setups, and ensuring production processes meet onsemi quality standards . Technicians will conduct routine checks, minor preventive maintenance, troubleshoot issues, and assist in process improvements. Accurate data recording, adherence to 5S, safety, and ESD compliance , and strong teamwork are essential.
Ideal candidates hold a Certificate/Diploma in Electrical, Mechanical, Mechatronics, or related fields, possess basic troubleshooting skills, and are willing to work shifts in a fast-paced environment. Prior experience in semiconductor processes is an advantage.
Responsibilities Die bond/Clip Bonder Technician – Job Description Responsibilities:
- Operate and monitor die bond/clip bonder machines to ensure stable production output.
- Perform die/clip attach processes according to SOP, work instructions, and Onsemi quality standards.
- Machine model involve will be ASM ( AD838, Twin 832P, SD890A, AD832D, ) & Shinkawa / Yamaha ( SPA 500, STC 500 )
- Conduct machine setup Minor/Major, alignment, recipe loading, and basic parameter adjustments.
- Perform regular machine checks, cleaning, and minor preventive maintenance.
- Identify process abnormalities, machine errors, and reject trends; report issues to engineers or supervisors promptly.
- Assist in troubleshooting equipment issues and support engineering improvement activities.
- Record production data accurately in system and ensure proper documentation.
- Ensure workplace 5S, safety compliance, and proper ESD handling at all times.
Wire Bonder Technician – Job Description Responsibilities:
- Operate and monitor wire bonder machines to ensure stable production output.
- Perform wire bond processes according to SOP, work instructions, and Onsemi quality standards.
- Machine model involve will be ASM ( Extreme family, Twin supreme, Eagle 60, ) / Shinkawa / Yamaha ( ACB 3000, ACB 1000, UTC 5100) / Kns ( Connx Plus & Elite )
- Conduct machine setup Minor/Major, alignment, recipe loading, and basic parameter adjustments.
- Perform regular machine checks, cleaning, and minor preventive maintenance.
- Identify process abnormalities, machine errors, and reject trends; report issues to engineers or supervisors promptly.
- Assist in troubleshooting equipment issues and support engineering improvement activities.
- Record production data accurately in system and ensure proper documentation.
- Ensure workplace 5S, safety compliance, and proper ESD handling at all times
Qualifications Requirements:
- Certificate/Diploma in Electrical, Mechanical, Mechatronics, or related fields.
- Experience in semiconductor die attach/die bonding / wire bonding/ mold-trim / final test process is an added advantage.
- Able to work in shift
- Basic troubleshooting and machine-handling skills.
- Good teamwork, discipline, and communication skills.
- Willing to learn and adapt in fast-paced production environment
About Us onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here: https://www.onsemi.com/careers/career-benefits
About The Team We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
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