About the role
About the role
As a Principal Engineer focusing on Etch, you will be a key technical leader in the Process Module team. You will be responsible for developing, optimizing, and sustaining cutting-edge etch processes critical to our semiconductor fabrication technology nodes. This role requires deep, hands-on etch technical expertise, a strategic mindset to drive advanced planarization solutions, and excellent communication skills to collaborate with cross-functional integration teams and external partners.
Key responsibilities
- Develop and modify etch process formulations, methods, and tool controls to meet stringent quality standards
- Analyze and review technical data and charts to ensure etch performance, focusing on non-uniformity, defectivity, and removal rate stability
- Establish and maintain Standard Operating Procedures (SOPs) and Failure Mode and Effects Analysis (FMEA) specific to the etch module
- Integrate etch equipment capabilities and material systems to meet process module and technology specifications
- Lead recipe creation, maintenance, and optimization for etch tools to ensure accurate process monitoring and improve recipe quality
- Drive Continuous Improvement Plans (CIPs) to enhance process performance and productivity
- Lead and participate in cross-functional teams to achieve organizational goals
- Serve as a technical subject matter expert for etch, providing guidance and training to junior etch engineers
- Solve complex, novel, and non-recurring technical problems
- Contribute to intellectual property by being a contributing inventor on patents related to etch technology
About you
- Master's or bachelor's degree in electrical, Electronics, Mechanical, Chemical, Materials Science Engineering or related field
- 5 to 8 years of relevant experience in wafer fabrication industry, with a strong focus on etch
- Good interpersonal and communication skills
- Good analytical and project management skills
- Organized and systematic in problem solving, familiar with SPC, DOE & FMEA
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