About the role
Job:
Manage and maintain Chip-on-Wafer (CoW) and advanced packaging equipment, including TCB, Flip-Chip Bonder, CMP, Dicing, and wafer cleaning systems.
Lead preventive maintenance, troubleshooting, root-cause analysis, and equipment optimization to maximize uptime, OEE, and yield.
Support new tool installation, utility hook-up, qualification, buy-off, and sub-micron calibration.
Drive downtime reduction, spare-parts management, and equipment reliability improvements.
Collaborate with Process, R&D, Manufacturing, and Quality teams to resolve equipment and yield issues.
Manage equipment vendors, including technical specifications, modifications, upgrades, and escalations.
Requirement :
4–10+ years of semiconductor equipment engineering experience, preferably in CoW, 2.5D/3D packaging, TCB/FCB, or advanced flip-chip
Experience in TCB, Flip-Chip Bonder, CMP, Dicing, and wafer cleaning Equipment .
Bachelor’s degree in Mechanical, Electrical/Electronic, Materials Engineering, or equivalent industry experience, with strong communication skills
All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.
Please email your resume in a detailed MS Word format to joyce@peopleprofilers.com stating
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Current Drawn
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Expecting Salary
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Date Available
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Reason to Leave each job:
We regret that only shortlisted candidates will be notified
Joyce Koh Ai Leng
People Profilers Pte Ltd
20 Cecil St, #08-09, PLUS Building, Singapore 049705
Tel: [6950 9737](tel:6950 9737)
www.peopleprofilers.com
EA License Number: 02C4944
EA Personnel Reg nos R1110618
Job ID: JOB-01084
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