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Memory Packaging Technical Manager

MediaTek

RemoteFull timeMid levelPosted today
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About the role

Job Description Product 2.5D/3D/3.5D heterogeneous package development, LPDDR/HBM/IPM development for advanced package, product memory roadmap, package memory architecture , customized HBM development

Main Requirements and Qualifications

    1. 10yrs DRAM (LPDDR/HBM..) technical experience, RD is a plus.

    1. Familiar with memory design, architecture, process, packaging, materials…
    1. Project handling experience

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