Engineer, Package Reliability

About This Role

This engineering role focuses on ensuring the quality and reliability of semiconductor packages for assigned product lines within a global quality team. It involves coordinating qualification activities for new products, designs, materials, and processes, and providing recommendations for product release. The position is ideal for a candidate passionate about innovation in semiconductor technology.

Responsibilities

• Lead and coordinate package qualification efforts for new products and process introductions
• Develop and implement robust qualification plans for new technologies and product developments
• Provide recommendation on new product release readiness based on reliability assessment outcomes
• Develop and devise reliability test plans to evaluate risks associated with excursions, conversions, and qualification issues
• Recommend effective screening methodologies for quality-sensitive lots
• Maintain and improve monitoring systems to ensure ongoing package quality
• Participate and drive in 8D problem-solving processes
• Coordinate root cause investigations and corrective action plans for qualification failures and customer RMAs
• Prepare and present technical reports for internal and external partners
• Serve as a technical liaison for both internal teams and external customers regarding package-related quality and reliability concerns
• Evaluate customer requests for alignment with Micron’s quality policies
• Provide technical expertise and support for customer inquiries and requirements
• Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements
• Contribute to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work

Requirements

• Good knowledge of semiconductor package assembly processes and surface mount technology
• Good understanding of thermo-mechanical, mechanical and material interactions affecting reliability in IC components and PCB assemblies
• Proficiency in industry-standard reliability test methods, life prediction acceleration models, and statistical sampling
• Good analytical problem-solving abilities and project management skills
• Good written and verbal communication skills in English
• Digital literacy
• Familiarity with backend manufacturing software systems
• Understanding of quality management and statistical tools (e.g., SPC, FMEA, 8D CAR)
• Self-motivated, meticulous, and capable of independent work and multi-cross functional team collaboration